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  • Sputtering Target
    Jan 17, 2018

    The coating target is sputtering source formed on various substrates by magnetron sputtering, multi arc ion plating or other type of coating system under proper conditions.


    The requirements of sputtering target material are higher than that of traditional materials industry. Generally, such as size, flatness, purity, impurity content, density, N/O/C/S, grain size and defect control. Higher requirements or special requirements include: surface roughness, resistance, grain size uniformity, composition and texture uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grains and so on. Sputtering target is a type of physical vapor deposition method, that is, to use the electron emission electron gun system and focus on the coating material, so that the atoms spun out will follow the momentum conversion principle and fly away from the material to the substrate to deposition film. This kind of plated material is called sputtering target.


    Magnetron sputtering coating is a new type of physical vapor coating method, compared to the evaporation coating method, which has a considerable advantage in many respects. Magnetron sputtering has been used in many fields as a well-developed technology.


    Sputtering Technology


    Sputtering is one of the main techniques for preparing thin film materials. It uses ions generated by an ion source to accelerate and aggregate in a vacuum to form a high-speed ion beam current that strikes a solid surface and exchanges kinetic energy between ions and solid surface atoms. The atoms on the solid surface leave the solid and deposit on the surface of the substrate. The bombarded solid is the raw material for preparing the sputter deposited film, which is called the sputtering target.


    Application


    Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc .; can also be applied to the field of glass coating; can also be applied to wear-resistant materials, high temperature corrosion , High-end decorative supplies and other industries.


    Classification


    1. According to the shape, it can be divided into square target, round target.

    2. According to the composition, it can be divided into metal targets, alloy targets, ceramic compound targets.

    3. According to the applications, it can be divided into semiconductor-related ceramic targets, recording dielectric ceramic targets, display ceramic targets, superconducting ceramic targets and giant magneto resistance ceramic targets.

    4. According to the application field, it can be divided into microelectronic target, magnetic recording target, optical disk target, precious metal target, thin film resistance target, conductive film target, surface modified target, decorative layer target, electrode target, packaging target and other targets.


    Principle of Magnetron Sputtering


    An orthogonal magnetic field and electric field are applied between the sputtered target (cathode) and the anode to fill the high-vacuum chamber with the required inert gas (typically, Ar gas). The permanent magnet forms 250 to 350 Gaussian magnetic field, with high-voltage electric field composed of orthogonal electromagnetic field. Under the action of an electric field, Ar gas is ionized into positive ions and electrons, and a certain negative high voltage is applied to the target. With the influence of the magnetic field, the probability of ionization of the electrons and the working gas emitted from the target increases, and high-density plasma is formed near the cathode. Ar ions accelerate to fly to the target surface under Lorentz force and bombard the target surface at very high velocity so that the atoms sputtered by the target follow the principle of momentum conversion and move away from the target surface to the substrate with higher kinetic energy deposited film.


    Magnetron sputtering is generally divided into two types: tributary sputtering and radio frequency sputtering, in which the principle of the tributary sputtering is simple, and the rate is faster when the metal is sputter. Radio frequency sputtering is more widely used. In addition to sputter conductive materials, but also sputtering non-conductive materials. And, it also prepared oxide, nitride and carbide compounds by reactive sputtering. If the radio frequency increases after the microwave plasma sputtering, commonly used electron cyclotron resonance (ECR) microwave plasma sputtering.


    Materials of Magnetron Sputtering Coating TargetMetal sputtering coating material, alloy sputtering coating material, ceramic sputtering coating material, boride ceramic sputtering coating material, carbide ceramic sputtering coating material, fluoride ceramic sputtering coating material, nitride ceramic sputtering coating material, oxide ceramic sputtering coating material, selenide ceramic sputtering coating material, silicide ceramic sputtering coating material, sulfide ceramic sputtering coating material, telluride ceramic sputtering coating material etc.


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