Atom sputtering target material: the material basis of the formation of membrane atom

Atom sputtering target material: the material basis of the formation of membrane atom

sputtering target material is the core of the phenomenon of sputtering coating, its essence is a high-energy ion by momentum transfer process of target material surface atoms out of the lattice. According to the collision theory, the sputtering yield (the number of target atoms that escape under the bombardment of a unit incident ion) is a key indicator for measuring sputtering efficiency, and its magnitude is closely related to the ion energy, ion type, target material and crystal structure. When the ion energy is relatively low (below the sputtering threshold, typically 10-50eV), the ions can only cause lattice vibrations in the target material's atoms and cannot escape them. When the ion energy exceeds the sputtering threshold, the sputtering yield rises rapidly with the increase of ion energy until it reaches the peak and then stabilizes. If the ion energy is too high (exceeding 10keV), the "injection effect" will be triggered due to the ions penetrating deep into the target material, resulting in a decrease in sputtering yield. From the perspective of the crystal structure of crystal orientation of sputtering target material phenomenon has significant influence. For single-crystal targets, when the direction of ion bombardment is perpendicular to the close-packed crystal planes of the target, the collision chains between atoms are longer and the sputtering yield is higher. This phenomenon is called "selective sputtering".

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