Low pressure CVD， LPCVD

Low pressure CVD， LPCVD

Low-pressure chemical vapor deposition (LPCVD) is a CVD reaction designed to reduce the operating pressure of the reaction gas during the deposition reaction in the reactor to approximately 133Pa. LPCVD equipment features: LPCVD low pressure and high heat environment improves the gas diffusion coefficient and the mean free path in the reaction chamber, and greatly improves the film uniformity, resistivity uniformity, and groove covering and filling ability. In addition, under a low-pressure environment, the gas material transmission rate is fast, and the impurities and reaction byproducts diffused from the substrate can be quickly taken out of the reaction zone through the boundary layer, while the reaction gas can quickly reach the substrate surface through the boundary layer for reaction. Therefore, self-doping can be effectively inhibited and production efficiency can be improved. In addition, LPCVD does not require carrier gas, thus greatly reducing the source of particle pollution. It is widely used in the semiconductor industry with high added value, as thin film deposition. The new development direction of LPCVD equipment: low stress, multi-function. For many commonly used micromachined materials, such as silicon nitride and polysilicon, stress is unavoidable. In some precision MEMS processes, low film stress is required to ensure small device deformation. (1) Through the unique design of the air path and cavity structure and the corresponding process formula, the film stress can be controlled in a large range successfully, and the problems of deformation, optical and mechanical properties changes caused by the existence of film stress are solved. (2) Meet customers' requirements for the TEOS low-pressure pyrolysis process and polysilicon process with different film forming rates, and ensure the uniformity of film forming and the warpage degree of the silicon wafer. (3) Multi-functional LPCVD equipment has a unique technology compared with the traditional way, Including good film process uniformity and repeatability, a unique filtration system to ensure good cleanliness and easy maintenance of chambers and devices, advanced particle control technology, high precision temperature field control and good temperature repeatability, complete factory automation interface, high-speed data acquisition algorithm, etc. At the same time, it has rich industry experience and a mature supporting process to meet customers' demand for high-end LPCVD equipment

IKS PVD company, decorative coating machine, tools coating machine, DLC coating machine, optical coating machine, PVD vacuum coating line, the turn-key project is available. Contact us now, E-mail: iks.pvd@foxmail.com