Chemical Vapor Deposition(CVD)

chemical vapor deposition(CVD)

CVD technology uses gaseous compounds or mixtures of compounds to undergo chemical reactions on the heating surface of the substrate, resulting in the formation of a non-volatile coating on the substrate surface.
Advantages: simple operation, strong flexibility, suitable for single or composite membrane and membrane layer; Wide applicability; Deposition rate can reach several microns to hundreds of microns per minute, high production efficiency; Suitable for coating complex shape matrix; The coating has good compactness.
Disadvantages: high deposition temperature, easy to lead to the degradation of substrate performance; Reaction gas and tail gas may be corrosive, flammable, and toxic to some extent. The coating is very thin.
CVD method is mainly applied in two general directions:
1, the preparation of coating, improve and improve the surface performance of materials or parts to improve or improve the oxidation resistance, wear resistance, corrosion resistance, and some electrical, optical, and tribological properties of materials or parts.
2. Develop new structural materials. At present, CVD technology has been widely used in many aspects, such as protective film, micro-electronic technology, solar energy utilization, optical fiber communication, superconductivity technology, preparation of new materials, and so on.
In addition, in the preparation of powder materials, using an efficient and stable catalyst to promote the CVD powder preparation process, or combining with physical methods to prepare powder materials under low temperature and high vacuum conditions has become the future direction of chemical vapor deposition technology development.

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