DLC Plasma-enhanced Chemical Vapor Deposition (PECVD)

DLC plasma-enhanced chemical vapor deposition (PECVD) refers to the decomposition of gas carbon sources into various carbon-containing neutral or ionic groups (such as CH3, CH2, CH+, C2, etc.) and atomic (or ionic) hydrogen (H, H+) through low-pressure plasma discharge, and the carbon-containing groups are bombarded and adsorbed on the substrate surface under the negative bias of the substrate. At the same time, atomic hydrogen can etch sp2 carbon in the structure, thus forming hydrogenated diamond-like films with sp2 and sp3 carbon hybrid structures. The method can improve the decomposition rate of raw gas, reduce the deposition temperature, and obtain the desired quality film by changing the deposition parameters.

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