Magnetron Sputtering Coating Technology

Magnetron sputtering coating technology has the following advantages · the deposition rate is large. Due to the high-speed magnetron electrode, the ion flow obtained is large, which effectively improves the deposition rate and sputtering rate of the coating process. Compared with other sputtering coating processes, magnetron sputtering has a high production capacity and large output and is widely used in various industrial production. · High power efficiency. The magnetron sputtering target generally selects a voltage within the range of 200V-1000V, usually 600V, because the voltage of 600V is just within the highest effective range of power efficiency. · Low sputtering energy. The magnetron target voltage is applied low, and the magnetic field restrains the plasma near the cathode, which prevents higher energy-charged particles from an incident on the substrate. · The substrate temperature is low. The anode can be used to guide away the electrons generated during discharge, without having to ground the substrate support, which can effectively reduce the electron bombardment of the substrate, so the temperature of the substrate is low, which is very suitable for some plastic substrate coatings that are not too resistant to high temperature. · Uneven etching on the surface of the magnetron sputtering target. The uneven surface etching of the magnetron sputtering target is caused by the uneven magnetic field of the target, and the local position etching rate of the target is large so the effective utilization rate of the target is low (only 20%-30% utilization rate). Therefore, if you want to improve the utilization rate of the target, you need to change the magnetic field distribution by certain means or use the magnet to move in the cathode, which can also improve the utilization rate of the target. · Composite target. Composite target plating alloy film can be made. At present, Ta-Ti alloy, (Tb-Dy) -Fe and Gb-Co alloy film have been successfully plated by composite magnetron target sputtering process. There are four kinds of composite target structures, which are round Mosaic target, square Mosaic target, small square Mosaic target, and fan Mosaic target, among which the fan Mosaic target structure is the best. · a wide range of applications. Many elements can be deposited by the magnetron sputtering process, common ones are Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti, Zr, SiO, AlO, GaAs, U, W, SnO, etc. Magnetic control coating technology is one of the most widely used coating processes for many high-quality film technologies, with diverse film types, strong controllability of film thickness, high film adhesion, good densification, and a very beautiful surface finish.

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