Principle Of PVD Vacuum Coating Technology

Principle of PVD vacuum coating technology
Physical Vapor Deposition (PVD) refers to physical vapor deposition, which consists of vacuum vapor deposition, vacuum sputtering deposition, and vacuum ion deposition. We usually say PVD coating, refers to vacuum ion coating and vacuum sputtering plating; Generally speaking, NCVM coating refers to vacuum evaporation coating. Basic principle of vacuum evaporation: Under vacuum conditions, metals and metal alloys are evaporated and then deposited on the substrate surface. The evaporation method is commonly used by resistance heating and electron bombardment of the plating material to vaporize into a gas phase and then deposited on the substrate surface. Historically, vacuum evaporation is the earlier technology used in the PVD process. The basic principle of sputtering coating film: under the vacuum condition of filling (Ar) gas, gas glow discharge, then argon (Ar) atoms ionize into nitrogen ion (Ar), ion under the action of electric field force, accelerate bombardment to the cathode target made of plating material, the target will be sputtered out and deposited to the workpiece surface. Incident ions in the sputtering coating film are generally obtained by glow discharge in the range of 10-2pa~10Pa, so the sputtered particles are easy to collide with gas molecules in the vacuum chamber in the process of flying to the substrate, so that the motion direction is random and the deposited film is easy to be uniform. Basic principle of ion plating: Under vacuum condition, some plasma ionization technology is used to partially ionize the plating atoms into ions, and at the same time produce many high energy neutral atoms to add negative bias on the plated substrate. In this way, under the action of deep negative bias, ions deposited on the substrate surface to form a thin film.

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