Vacuum Ion Plating

Vacuum ion plating

The molecules of evaporating material are ionized by electron collision and then deposited on the solid surface by ions, which is called ion plating. This technique was proposed by D. Mettox in 1963. Ion plating is a combination of vacuum evaporation and cathode sputtering. The ion plating system generally uses the substrate as the cathode, the shell as the anode, and is filled with an inert gas (such as argon) to produce a glow discharge. Molecules vaporized from an evaporation source ionize as they pass through a plasma region. Positive ions are accelerated to the substrate surface by negative voltage. Unionized neutral atoms (about 95% of the vaporized material) are also deposited on the substrate or the wall surface of the vacuum chamber. The adhesion strength of the film is greatly improved by the acceleration of the ionized vapor molecules by an electric field (ion energy is about several hundred ~ several thousand electron volts) and the sputtering cleaning of the substrate by argon ion. The ion plating process combines the characteristics of evaporation (high deposition rate) and sputtering (good film adhesion), and has good diffraction, which can be used for the coating of complex shape workpieces.

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