Plasma Enhanced Chemical Vapor Deposition

Plasma Enhanced Chemical Vapor Deposition

PECVD (principle) is the use of microwave or radio frequency to ionize the gas containing film component atoms, forming a local plasma, and the plasma is very chemically active and easy to react, depositing the desired film on the substrate.
In order to make the chemical reaction can be carried out at a lower temperature, the activity of plasma is used to promote the reaction, so this CVD is called plasma enhanced chemical vapor deposition (PECVD).

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