Influence Of Magnetron Sputtering Process Parameters: Target Current

Influence of magnetron sputtering process parameters: target current

By changing the target current, the relative content of each element in (Cr,Ti,Al) N quaternary coating can be controlled, and the energy of sputtered particles bombarding the target can be changed, thus affecting the microstructure and properties of the coating. Studies have shown that the coating hardness increases with the increase of Ti target current [63-64]. On the one hand, with the increase of Ti target current, the Ti content in the coating increases, and the TiN hard phase appears, thus increasing the hardness of the coating. On the other hand, with the increase of Ti target current, Ti atoms dissolve in CrN to form Cr-Ti-N solid solution, which enhances the solid solution strengthening effect, and therefore increases the hardness of the coating [63]. In addition, with the increase of Ti target current, the bombardment effect of Ar ions on the coating is enhanced, and the density of the coating is improved, thus increasing the hardness of the coating [64]. Therefore, the increase of coating hardness is the result of the joint action of phase and structure densification.

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