Physical Vapor Deposition (PVD)

Physical Vapor Deposition (PVD)

Physical Vapor Deposition (PVD) technology. Under vacuum conditions, the surface of the material source (solid or liquid) is first vaporized into gaseous atoms, and molecules or partially ionized into ions, and through the low-pressure gas (or plasma) process, a film with a special function is deposited on the surface of the substrate.
The PVD deposition process can be roughly divided into three parts: evaporation of the plating, migration of the plating, and deposition of the plating.

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