Three solutions to target binding

Three solutions to target binding

Commonly used target binding methods include adhesive, solder, and high-temperature welding (including brazing and diffusion welding). With these three binding technologies, we can provide the best target binding solutions for our customers' applications.

Adhesive binding

Silver binding is the least costly technology that uses specialized thermal and conductive epoxy resins to bind the target to the backplane. This technique requires surface treatment of the target and the backplane. The bound target has low residual stress and is easy to rework. However, the disadvantage of Ag binding is that it has a relatively high thermal resistance, which limits the power density used by the sputtering target and therefore limits the deposition rate.

Solder binding

The solder has a lower thermal resistance than the silver binder and is, therefore, able to operate at a higher deposition rate. The most common solder filler we use is indium, which has the advantage that indium has high thermal conductivity and a relatively low melting point and elastic modulus, thus reducing the residual stress after binding. Its low melting point also simplifies binding rework and allows reuse of the backplane. The entire binding process can be carried out in the air, thus reducing the binding cost.

The high temperature of welding

Techniques such as high-temperature welding (combination of brazing and diffusion welding) are a third technique that can be used. These processes are performed at temperatures above 500 ° C and require the use of vacuum or controlled atmosphere ovens. For brazing, a joint is achieved by melting a brazed alloy at the joint to form a joint. For diffusion welding, the filler is not used, but bonding is achieved by heating the backplane at high pressure to a temperature where mutual diffusion with the target occurs. The result is a very low thermal resistance, often close to or below that of the parent alloy, and allowing for the highest possible power density. The use of high-temperature welding technology is limited by several factors. The ASSOCIATED costs ARE HIGHER, PLUS THE bonding IS EXTREMELY stressed UNLESS THE MATERIAL EXPANSION COEFFICIENTS OF THE backBOARD MATCH PERFECTLY. In addition, the binding cannot be reworked, which means that the backplane cannot be reused.

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