Why is electron beam-assisted physical vapor deposition a better method for film deposition?
Jul 19, 2022| Why is electron beam-assisted physical vapor deposition a better method for film deposition?
The ability to coat a variety of surfaces with specific materials is critical to providing technologies and products for our everyday lives. At the industrial level, there are several competing coating methods whose application depends on the requirements of the final product, the properties of the material, feasibility, and cost-effectiveness Among all these methods, electron beam-assisted physical vapor deposition (EBPVD) plays a very special role. On the one hand, it can achieve higher evaporation rates than the cheap thermal evaporation method. On the other hand, materials can only evaporate in a vacuum and have a high energy density, which is characteristic of an electron beam, In addition, the so-called sublimation method can be completed using electron beam technology such as the silica deposition method used in the packaging industry for polymer film barrier film layer in addition to the polymer film, there are other substrates can be coated with relatively dense film, such as metal strip glass or turbine blades For these applications, EBPVD can also be combined with other methods, such as plasma spraying, which helps to meet the complex material characteristics required by the aerospace industry. In the simplest case, the material to be vaporized can be concentrated in a single point source, where an electron beam melts the material in a point crucible If the size is correct, the resulting lobe clouds can on the target material to form a homogeneous membrane layer deposition The point source of combination can also make the lobe clouds overlap, and in the larger base material width is implemented on uniform film deposition. If the film thickness control is more demanding, can use an adjustable beam of electrons instead of the static process This is because the electron beam can be easily and precisely controlled by scanning the entire width of the crucible at high speed. The strength of the electron beam is controlled by a film thickness measurement system covering the same width. In order to increase the width of the coating area, multiple electron beam guns can be used across the entire width In conclusion, we can say that the use of reliable electron beam systems in physical vapor deposition has first facilitated the implementation and cost-effective application of a variety of coating methods. In addition, the combination of EBPVD with other coating methods has realized a wide range of application prospects.
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