High-power Pulse Magnetron Sputtering Technology

High-power pulse magnetron sputtering technology

High-power pulsed magnetron sputtering technology applies pulsed plasma discharge to the process of magnetron sputtering. It is a kind of pulsed sputtering technology that uses higher pulse peak power and lower pulse duty cycle to achieve the high ionization of sputtered atoms of the target. The high-power pulsed magnetron sputtering technology combines the advantages of low-temperature deposition, smooth surface and no particle defects, as well as the advantages of high ionization rate, strong film-based binding force and dense coating of arc ion gold plating. The deposited particle beam with high ionization rate does not contain large particle impurities such as "metal droplets". It has significant technical advantages in controlling the microstructure of the coating, obtaining excellent film-base bonding force, reducing the internal stress of the coating, and improving the density and uniformity of the coating. The preparation of hard coatings by high-power pulsed magnetron sputtering has become one of the current research hotspots, and this technology has also made gratifying progress in the deposition of (Cr,Ti,Al) N coatings, which is a physical vapor deposition technology with broad prospects.

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