Reactive magnetron sputtering coating

Reactive magnetron sputtering coating
Reactive sputtering is a process in which a thin film of compounds is deposited by introducing a reactive gas (oxygen or nitrogen). It is usually used for sputtering oxides, nitrides, carbides, and mixtures of all three. In the reactive sputtering process, the reaction gas reacts with the sputtering target and is then deposited on the substrate. The aim of reactive sputtering is to produce thin films that are stoichiometric and structurally controlled. The composition of the film can be controlled by controlling the relative quantities of inert gas and reactive gas.

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